Controlled PEMs, a High Density Packaging Solution for Space
- Topics:
- Electrical and Electronic
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Overview: This white paper in general deals with a controlled insertion of plastic encapsulated microcircuits (PEMs) which is demonstrated and highlights how this technology can provide a superior integrated circuit (IC) packaging solution over traditional ceramic based assemblies. Space qualified insertion of Plastic Ball Grid Array (PBGA) packages addressing high I/O packaging needs is the focus of this publication. Space-qualification of a laminate-based area array packaging technology responds to the ever increasing demand for reliable, cost effective, high density interconnect (HDI)solutions. The paper also reviews a proven methodology for controlling the design, fabrication, assembly, test, and qualification.
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Format: PDF | Size: 309KB | Date: May 2001 | Pages: 6



