Close the Information Gap on IC-Package Reliability

Topics:
Electrical and Electronic
Tags:
Reliability
Source:
National Aeronautics and Space Administration

FREE Registration is required

Overview: This white paper provides answers to the challenges of increase reliability and functionality with lower cost for electronic devices as the surface-mount (SMT), package options that can be loosely divided into two groups: ball-grid arrays (BGAs) and chip-scale packages (CSPs). The paper also gives a review of the board-level reliability of CSP assembly and the projected values for specific environmental conditions were extracted from the data. These findings offer valuable information on package robustness, and provide a better understanding of the challenges associated with the implementation of SMT technology, particularly with the new, advanced, miniature CSPs.

(Is this item miscategorized? Does it need more tags? Let us know.)

Format: PDF | Size: 36KB | Date: Jan 2000 | Pages: 13

People who downloaded this item also downloaded

White Paper Thermal Challenges in the Future Generation Solid State Lighting Applications: Light Emitting Diodes
White Paper Calling All Spacecraft!
White Paper Accelerated Thermal and Mechanical Testing of CSP Assemblies
White Paper Capabilities and Reliability of LEDs and Laser Diodes

Top results from Electrical and Electronic

White Paper Asserting Control, Seizing Opportunity in High Tech: Five Critical Success Factors
White Paper Control Schema Yields a Better Textile Machine
White Paper Electronics Manufacturing in Emerging Markets Will See Five-Year Growth of $60 Billion by 2005
White Paper Essential Cooling System Requirements for Next Generation Data Centers
White Paper Merchant Markets and Applications for AC/DC Switching Power Supplies, DC/DC Converters, and Telecom Rectifiers

» View all Electrical and Electronic listings

advertisement
advertisement
  • Click Here
  • Click Here
  • Click Here
advertisement

Returning users: Log In Here!

Already registered on BNET, TechRepublic, or ZDNet? Simply log in.

Free Membership: Sign Up Now!

Sign up for a free membership today and get instant and unlimited access to one of the largest databases of white papers, webcasts, and casestudies anywhere. Your FREE membership allows you to:

  • Download an unlimited amount of content, including classic and current white papers, case studies, webcasts and more
  • Track content on your chosen topics of interest
  • Receive targeted email alerts when your favorite content is added
  • Save content for future reading
  • Receive our member newsletter

When you register to access this directory, you become a member of BNET. In addition, you allow us to share your information with companies that produce products or services featured in the library--so that such companies may contact you with information and offers regarding their products and services. This enables us to keep the library a free service. As a directory registrant, you will receive a complimentary subscription to the BNET member newsletter, The BNET Report. You can unsubscribe from this newsletter at any time. By clicking the Sign up button, you indicate that you agree to our Terms and Conditions and have read and understand our Privacy Policy (updated).