A Systems Approach for Quality and Reliability of Chip Scale Package assembly

Topics:
Electrical and Electronic
Tags:
Chip,
Hardware,
Network Technology,
Networking,
Reliability,
Semiconductors
Source:
National Aeronautics and Space Administration

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Overview: This white paper document deals with factors that affect interconnect reliability of commercial-off-the -shell (COTS) chip scale package assemblies. The paper discusses about the preliminary thermal cycling results for test vehicles. The paper also concludes that the availability of meaningful assembly reliability test results is needed to accelerate implementation of this technology.

(Is this item miscategorized? Does it need more tags? Let us know.)

Format: PDF | Size: 614KB | Date: Apr 2000 | Pages: 6

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