Board Flexure Comparison between Surface Mount Multi-Layer Ceramic and Film Capacitors
- Topics:
- Electrical and Electronic
- Source:
- Illinois Tool Works
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Overview: This paper discusses about the Surface mount production techniques that are the standard in electronics manufacturing; components are now subjected to mechanical stresses during both assembly and use. Flexure or printed wiring board (PWB) bending is a significant source of these stresses that can lead to component breakage and failure. It also features about the flexure or bending that can come from a number of sources such as soldering, panel separation, or rough handling after soldering during installation or product use. It also provides relevant information about the Ceramic capacitors.
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Format: PDF | Size: 314KB | Date: Jan 2000 | Pages: 8



