The Application of Nanosecond-Pulsed Laser Welding Technology in MEMS Packaging With a Shadow Mask

Topics:
Mechanical and Industrial
Tags:
Laser,
MEMS,
NeoKinetic Systems
Source:
NeoKinetic Systems

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Overview: This white paper discusses about the nanosecond-pulsed laser bonding process. The paper gives an insight about the optical bonding energy for glass-to-silicon bonding using a 4 micrometer thick indium layer as bonding material. It also shows simulation results in the form of localized heating that can be achieved by using the nanosecond laser. This laser welding is usually applied to suitable localized heating and bonding applications.

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Format: PDF | Size: 289KB | Date: May 2002 | Pages: 7

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