Optimizing Chemical Vapour Deposition Processing Through RF Technology

Topics:
Chemical
Tags:
Advanced Energy Industries,
Hardware,
Integrated Circuit,
Productivity,
RF Monitoring System,
Semiconductors,
Tool,
Wafer
Source:
Advanced Energy Industries

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Overview: This paper describes Digital Equipment Corporation Semiconductor Division's application of real-time process control, excursion detection, and clean optimization on a PECVD (Plasma Enhanced Chemical Vapor Deposition) wafer processing tool. The purpose of this effort is to reduce test wafers, spare part usage, and tool downtime, while increasing product yield and tool throughput. The RF monitoring system is an RF Metrology System (RFMS) supplied by Fourth State Technology of Austin, Texas. Digital Semiconductor uses a PECVD tool to deposit post metal dielectric layers during the production of their integrated circuit devices.

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Format: PDF | Size: 359KB | Date: Nov 2003 | Pages: 8

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